Liquid Cooling
Vertiv CoolChip CDU
Facility-to-technology cooling-water control for high-density direct-to-chip liquid cooling.
Review the seriesFrom facility water to the chip
Liquid Cooling for GPU Infrastructure
Coordinate CDUs, secondary loops, controls and heat rejection for direct-to-chip deployments.
Final design and equipment selection require project-specific engineering inputs.
Target outcome
A system-level liquid-cooling concept that avoids treating the CDU as an isolated equipment purchase.
Why this is difficult
- Facility water conditions may not match technology-loop requirements.
- Temperature, flow, pressure and water-quality assumptions must align.
- The air-cooled remainder of the rack and room still needs capacity.
Engineering workstreams
What the solution must connect.
- 01IT heat-load split between liquid and air
- 02CDU sizing and redundancy
- 03Primary and secondary loop definition
- 04Dry cooler or chiller interface
- 05Leak detection, controls and commissioning scope
Before we size equipment
Send these six design inputs.
If some values are not yet known, say so. The uncertainty itself becomes part of the engineering review.
- 01Liquid-cooled rack quantity
- 02Heat captured to liquid
- 03Required coolant temperatures and flow
- 04Facility-water availability
- 05Water-quality and material compatibility
- 06Redundancy and maintenance philosophy
Relevant product families
Equipment considered inside this architecture.
Precision Cooling
Vertiv Liebert CRV4S
Close-coupled in-row precision cooling for dense rack environments and contained aisles.
Review the seriesRequest a project review
Turn your liquid cooling for gpu infrastructure brief into a configuration path.
Our engineering team will turn the brief into a product shortlist, open technical questions and a quotation path.