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High-density infrastructure

AI Data Center Power & Cooling

Turn GPU rack plans into an engineered power and heat-rejection architecture—from utility input to the chip.

Final design and equipment selection require project-specific engineering inputs.

Target outcome

A traceable basis of design that connects rack density, total IT load, redundancy, electrical topology and cooling method.

Why this is difficult

  • Rack nameplate power is not the same as facility design load.
  • Power and cooling decisions are often made by separate teams.
  • Future GPU generations can invalidate a narrowly sized first phase.

Engineering workstreams

What the solution must connect.

  1. 01Load model and growth phases
  2. 02UPS, battery and distribution topology
  3. 03Air, liquid or hybrid cooling architecture
  4. 04Heat-rejection and control interfaces
  5. 05Equipment schedule and technical submittals

Before we size equipment

Send these six design inputs.

If some values are not yet known, say so. The uncertainty itself becomes part of the engineering review.

Relevant product families

Equipment considered inside this architecture.

Vertiv HPL P1

Energy Storage

Vertiv HPL P1

A LiFePO4 battery-cabinet family for high-rate UPS backup in data centers and industrial critical-power systems.

384–512 V; 70 Ah or 140 Ah configurations
Review the series

Request a project review

Turn your ai data center power & cooling brief into a configuration path.

Our engineering team will turn the brief into a product shortlist, open technical questions and a quotation path.